SPI是产业最快速的锡膏印刷检测机，检测速度高达200 cm2/sec。高精度在线型无阴影的锡膏印刷检测解决方案提供全3D检测，分辨率包含15 µm or 10 µm并具备高精度线型马达平台。此系统的特点包括closed loop function、强化的2D成像技术、自动板弯补偿功能与条纹光扫描技术。TRI快速且直觉化的操作介面提供简易编程、容易操作的优点，为您的生产线带来最大的价值• 业界最快速的锡膏印刷检测机• 无阴影条纹光检测技术• 光学分辨率提供10 µm 及 15 µm 两种选择• 线性马达设计可提供无震动精确检测• 先进的SPC功能提供生产质量监测与评估

Imaging Method Dynamic ImagingCamera 4 MpixImaging Resolution 10 µm or 15 µm (factory setting)Lighting RGB LED3D Technology 2-way Fringe PatternField of View 4 Mpix@ 10 µm: 20 x 20 mm4 Mpix@ 15 µm: 30 x 30 mmInspection PerformanceImaging Speed 4 Mpix@ 10 µm: 90 cm²/sec4 Mpix@ 15 µm: 200 cm²/secHeight Resolution 0.4 µmMax. Solder Height @ 10 µm: 600 µm@ 15 µm: 550 µmMotion Table & ControlX-Axis Control Linear Motor and linear scale with DSP-based controllerY-Axis Control Ballscrew + AC-servo controllerZ-Axis Control Ballscrew + AC-servo controllerX-Y Axis Resolution 0.5 µmZ-Axis Resolution 1 µmBoard HandlingMax PCB Size TR7007 SII Plus: 510 x 460 mmTR7007L SII Plus: 660 x 610 mmTR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lanePCB Thickness 0.6-5 mmMax PCB Weight 3 kgTop Clearance 25 mmBottom Clearance 40 mmEdge Clearance 3 mmConveyor Height 880 – 920 mm* SMEMA Compatible